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Minimum qualifications:
Bachelor's degree in Computer Science, Electrical Engineering, or equivalent practical experience.
5 years of experience with thermal product design.
Experience with programming/scripting with Python and MATLAB to develop in-house tools for data processing and automation.
Experience working with heat transfer, SoC Design and IC Packaging.
Preferred qualifications:
Master's degree in Computer Science, Electrical Engineering, or a related field.
Experience with optimization of thermal, power and performance.
Experience in thermal/performance measurements and characterization on consumer devices.
Understanding of ASIC digital design, design validation, and power optimization.
Knowledge of hardware and software based thermal/power management control algorithms.
Responsibilities
Develop detailed Computational Fluid Dynamics (CFD) and compact RC models for SoC and Package thermal analysis.
Place temperature sensors and optimize floor plans.
Optimize thermal performance under Performance, Power, Area (PPA) and system design constraints.
Simulate and prototype thermal control strategies.
Validate thermal models through power/thermal measurements on hardware.
Job ID: 109808309