Semiconductor Packaging – Mechanical Modeler

Key Responsibilities:

• Develop and simulate system-level hardware models using CAD and FEA tools.
• Acquire or collaborate to obtain accurate material properties for modeling.
• Analyze qualification test data and validate against simulation results.
• Prepare detailed technical reports and presentations for stakeholders.
• Provide design guidelines for components such as laminates, TIMs, coolers, chips, GPUs, HBMs, and load actuation hardware.
• Influence design decisions to ensure robust packaging and system integration.
• First-level packaging (chip, laminate, module) and module-to-socket integration
• Required technical and professional expertise
• Master's/PhD in Mechanical Engineering.
• 3+ years of experience in Finite-Element Modeling (FEM).
• Proficiency in CAD (SolidWorks preferred) and FEM tools (ANSYS or Abaqus).
• Ability to create scripts (APDL, Python) beyond GUI modifications.
• Experience in design for manufacturability (DFM).
• Hands-on lab experience.
• Strong communication, problem-solving, and time management skills.
• Ability to work independently and in cross-functional teams.
• Familiarity with electronic packaging and heterogeneous integration.
• Preferred technical and professional experience
• 5+ years in mechanical modeling.
• Experience in static structural FEA (stress, strain, warpage prediction).
• Moisture diffusion and swelling simulation expertise.
• Knowledge of server/computer architecture.
• Experience with lab toolstensile testers (Instron/MTS), DMA, TMA, TGA.
• Applied statistics and DOE knowledge (Minitab, JMP).
• Programming experience in Matlab, Python, LabView, or C++.