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Ceragon Networks

Team Leader-Mechanical Engineering

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  • Posted 9 hours ago
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Job Description

Job Description

  • Experience in design for manufacturing (DFM) including plastic injection molding, metal casting, machining, stamping, and forming
  • Experience in electronic board design
  • Experience in electronic board design
  • Experience in leading full life cycle projects
  • Experience with PLM systems, engineering changes, BOM structuring, etc.
  • Experience in design of indoor and outdoor equipment
  • Experience in thermal, dynamical and statical design and analysis
  • Experience in design of telecommunication/RF equipment an advantage
  • Perform analysis, testing, design iterations and validation of the designs
  • Proficiency in SolidWorks

Job Requirements

  • BSc in Mechanical Engineering .
  • At least 10 years of experience in electronics packaging design
  • At least 5 years experience as a team leader.
  • Strong understanding of GD&T, drawings, assembly tolerances
  • Team player with strong technical and communication skills
  • At least 3 years of experience leading a team leader position.

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About Company

Job ID: 136386381