Staff Engineer

Responsible for Physical Verification, Reliability Sign-off, EM/IR Analysis, Power Grid Design, Analog/Mixed-Signal Integration, and methodology development for complex low-power SoCs targeting IoT and MCU applications

Your role

Key responsibilities in your new role

• Drive Physical Verification (PV), ESD, and Reliability Sign-off activities for complex low-power SoCs targeting IoT and MCU applications.
• Perform Physical Design and Timing Closure for ICW SoCs. Execute and own Physical Verification and Reliability Checks to ensure design quality and manufacturability.
• Conduct Power Grid Design, including power switch estimation and optimization.
• Perform Static and Dynamic EM/IR Analysis for multi-voltage and multi-power domain designs.
• Lead I/O Planning and Package Co-design activities for SoC implementation.
• Drive Analog and Mixed-Signal IP Integration into SoC designs.
• Develop and improve design flows, methodologies, QoR (Quality of Results), and sign-off processes.
• Collaborate closely with Physical Design, STA, DFT, RTL, DV Engineers, and Chip Architects to ensure successful project execution.
• Support implementation of SoCs with multiple voltage islands, power islands, and low-power design techniques
  
  

Your profile

Qualifications And Skills To Help You Succeed

• Bachelor's or Master's degree in VLSI Design with 5 -8 years of relevant industry experience.
• Hands-on experience in Physical Verification (PV), ESD, and Reliability Sign-off for complex SoCs.
• Strong expertise in Power Grid Design, Power Switch Estimation, and Static/Dynamic EMIR Analysis for multi-voltage and multi-power domain designs.
• Deep understanding of low-power SoC implementation, including multiple voltage islands, power islands, and power reduction techniques.
• Experience with industry-standard Physical Verification and Power Grid Sign-off tools.
• Knowledge of semiconductor technologies including 40nm, 28nm, and 22nm nodes, along with WireBond and FlipChip packaging methodologies.
• Proficiency in scripting and automation using Shell, Perl, Tcl, and Make-based flows.
• Experience in I/O Planning, Package Co-design, and Analog/Mixed Signal IP Integration for SoC designs.
• Proven ability to drive flow and methodology improvements to enhance QoR and Sign-off efficiency.
• Strong ownership, technical commitment, and a results-oriented mindset.
• Highly organized, detail-oriented, and methodical in problem-solving and execution.
• Demonstrated ability to take initiative, drive innovation, and overcome technical challenges.
• Effective collaborator with the ability to work across Physical Design, STA, DFT, RTL, DV, and Architecture teams.
• Excellent communication skills with a track record of knowledge sharing and cross-functional partnership
  
  

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in

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