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Senior Staff Engineer – Physical Design (Full-Chip STA)
Location: Bengaluru, India
Experience: 10–16 Years
Role
Own Full-Chip STA Signoff for next-generation high-performance SoCs. Lead timing architecture, signoff methodology, and timing convergence across advanced technology nodes, enabling first-pass silicon success.
What You'll Do
What You Bring
Preferred
We're Looking For
A highly technical STA leader who can own full-chip timing signoff, architect scalable STA methodologies, solve the most challenging timing closure problems, and drive first-pass silicon success for next-generation semiconductor products.
Job ID: 151988497
Skills:
power integrity , Shell, Perl, Python, Tcl, Physical Design signoff, Ansys RedHawk, IR EM analysis, Cadence Voltus
Skills:
redhawk , Python, Routing, Perl, Tcl, OCV, Signoff, CTS, Fusion Compiler, advanced packaging technologies, ICC2, SDC development, Tempus, hierarchical STA, SI Crosstalk, StarRC, POCV, Placement, UPF Low-Power, floorplanning, CRPR, MCMM timing closure, AOCV, ECO timing closure
Skills:
Wireshark, Zigbee, Wlan, Thread, Python, Iperf, Ellisys sniffers, Bluetooth BR, LE Audio
Skills:
Perl, Verilog, Python, spyglass, VHDL, DDR memory controllers, PCIe protocols
Skills:
Tensorflow, Pytorch, MLops, Terraform, Docker, Kubernetes, Python, AWS, LangChain, Scikit-learn, event-driven systems, Go, LangGraph