Ole Overview
SME - Solder Paste Printer & Reflow Soldering is responsible for overseeing, optimizing & continuously improving processes to ensure on-time manufacturing with high quality of all ISP Products.
The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams.
Key Responsibilities
- Technology & Process Setup
- Manage & Optimization of SMT Production Processes of Solder Paste Printing , Inspection & Reflow.
- Define and maintain all process windows, control plans & CTQ across all products of SPP , SPI & Reflow.
- Setup, Operate, Programming, Optimizing SPP & Reflow Soldering machines.
- Setup & Validation of Stencils, Squeegees, Solder Paste types & Printing parameters.
- Develop & validate thermal profiles for new & existing PCB assemblies.
- Stencil Design & Validation.
- Conduct DOE & Process validation for new products and materials.
- Setup , Monitor & Control critical reflow parameters
(Zone temp., Conveyor Speed, Soak time, Peak temp.)
- New Model Readiness
- Develop & Maintain Process documentation, WIs & SOPs (SPP, SPI & Reflow)
- All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation.
- Partner with NPI, TDG to ensure DFMEA and PFMEA of SPP,SPI & Reflow (related to soldering & thermal constraints )
- Ensure proper solder paste reflow per component and PCB design requirements
- Ensure smooth technology transfer from development to production.
- Own ramp-up metrics: yield learning curve, cycle time, scrap reduction.
- Quality Excellence
- Accountable for first pass yield, final yield and field reliability.
- Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis.
- Monitor production yield , defect rates , cycle time and implement corrective / preventive actions.
- Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints and solder balls
- Partner with Quality team to address customer returns, audits and escalations.
- Monitor Process parameters ( temp. Zones , conveyor speedsoak time etc )
- Analyze & control print defects ( Insufficient / excess paste , smearing , bridging , skips , misalignment)
- Analyze soldering defects ( tombstoning , voids , cold joints , bridging etc ) and implement corrective actions
- Operational Excellence & Cost Optimization
- Own cost of ownership and productivity improvement initiatives.
- Drive Cycle time and line balancing improvements.
- Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing )
- To ensure Proper line setup , programming , Program version management ( SPP , SPI & Reflow )
- To ensure compliance with ESD , Safety& IPC standards.
- Analyze process data , SPC reports to identify trends & improvement opportunities.
- Customer & Stakeholder Engagement
- Serve as a technical team member for customers on PCBA Soldering process topics.
- Will be technical team member for customer reviews, technology discussions and risk mitigation plans.
Key Deliverables & KPI
- First Pass Yield
- Yield and Reliability Performance
- Productivity Improvement
- Cost Optimization
- Customer satisfaction and audit outcomes.
Required Qualifications
- Bachelor in related Engineering Discipline (Preferred Electronics Engineering)
- 10-12 years hands on experience in SMT industry in a similar role ( Paste Printing , Inspection & lead free soldering processes )
- Experience in high volume manufacturing environment.
- Hands on knowledge of SPP machines ( MPM Momentum / ASM Dek / Ekra / GKG / Fuji / Panasonic )
- Hands on experience with SMT reflow ovens with vacuum / without vacuum ( Heller / Ersa Rehm / Vitronics Soltec etc )
- Familiar with thermal profilers ( KIC , Datapaq , ECD etc )
- Deep Understanding of solder paste behaviour & thermal profiling
- Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE )
- Strong knowledge on Stencil designing (Thickness , aperture , step up / down stencils )
- Familiar with Lean manufacturing
