Principal, IC Package Engineer

Are you looking for a unique opportunity to be a part of something great Want to join a 17,000-member team that works on the technology that powers the world around us Looking for an atmosphere of trust, empowerment, respect, diversity, and communication How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our we affectionately refer to it as the and it's won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo we did not achieve record revenue and over without a great team dedicated to empowering innovation. People like you.

Visit our page to see what exciting opportunities and company await!

Job Description:

The Mixed Signal Development Group is responsible for delivering high-speed analog and mixed-signal IP to divisions within Microchip. We work with leading edge CMOS processes to produce analog integrated circuits for wireline applications. From PCIe to 128+Gb/s SERDES, we enable technology that allows Microchip's products to interface to the outside world.

As a member of the Mixed-Signal Development Group, the candidate will be supervised by a team manager, and be engaged in the package design and layout.

Responsibilities:

• Conduct package routing feasibility and substrate layouts for Microchip high-speed products, including MCM packages
• Perform simple PCB breakout studies for ball map feasibility
• Identify key issues for proposed designs based on silicon floor plans and desired package sizes
• Work with signal integrity engineers to implement high speed signal routes and quiet power routes
• Work with reliability engineers and external vendors to ensure manufacturability of package designs
• Create package routing constraints based on signal integrity routing rules
• Interact with and oversee work of external and internal package designers
• Produce package routing reports and diagrams for review by external teams
• Create and track package design schedules
• Guide and assist external design teams on creation of input data for package design flow.

Requirements/Qualifications:

• Applicable Bachelor's or Master's Degree
• 10+ years of industry experience
• Expert in package design using Cadence APD
• Expert in authoring APD design rules
• Scripting in PERL or SKILL is an asset
• Familiarity with flip chip and wire bond package designs
• Familiarity with PCB design and BGA fanout issues
• Understanding of high speed and power routing rules/issues
• Capable of handling multiple tasks at once
• Customer oriented, with attention to detail