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Hardware Applications Engineer, Senior

2-7 Years
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Job Description

General Summary

Qualcomm, a leader in technological innovation, is seeking an experienced Hardware Applications Engineer to join its Customer Engineering team, focusing on IoT solutions. In this role, you will collaborate closely with customers to support hardware design sign-offs, system-level and PCB debugging, and help accelerate product development using Qualcomm hardware and software platforms.


About The Role

  • Provide technical expertise on Qualcomm chipsets through documentation, training, and product demonstrations
  • Assist customers with hardware design reviews, troubleshooting at SoC, system, and PCB levels
  • Create and maintain design collaterals such as reference schematics and training materials
  • Support high-speed digital interfaces, power management, and system-level debugging during board bring-up
  • Collaborate with cross-functional teams and multi-geography customers and stakeholders


Minimum Qualifications

  • Bachelor's degree in Electrical/Electronics Engineering, Computer Engineering, or related field with 2+ years of relevant experience
  • OR
  • Master's degree in Electrical/Electronics Engineering, Computer Engineering, or related field with 1+ year of relevant experience
  • OR
  • PhD in Electrical/Electronics Engineering, Computer Engineering, or related field


Preferred Qualifications and Skills

  • Strong understanding of digital/baseband hardware design and PCB design
  • Expertise in troubleshooting and debugging hardware during board bring-up
  • Experience with power management components such as LDOs and SMPS
  • Knowledge of high-speed digital interfaces: UFS, eMMC, LPDDR, NAND, MIPI DSI/CSI, USB, PCIe, Ethernet, SPI, I2C, UART, JTAG
  • Familiarity with digital ASICs, system design, system-level clocking, and interface handshakes
  • Hands-on experience with oscilloscopes, logic analyzers, and other test tools
  • Basic knowledge of ARM processors, multi-core systems, and JTAG emulators
  • Proficiency in PCB signal and power integrity, schematic review, and layout tools (Cadence Allegro, Siemens Mentor Graphics)
  • Experience with multi-layer PCB designs, vias, and stack-up configurations
  • Ability to engage with global customers and stakeholders effectively
  • Familiarity with prototyping platforms such as Arduino and Raspberry Pi is a plus

More Info

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Open to candidates from:
Indian

About Company

QUALCOMM CDMA Technologies (QCT) is the largest provider of 3G chipset and software technology in the world, with chipsets shipped to more than 50 customers and powering the majority of all 3G devices commercially available. QCT partners with nearly 60 3G network operators around the globe and has the largest CDMA engineering team in the wireless industry.
QCT provides complete chipset solutions and integrated applications from the Launchpad suite of advanced technologies. Our integrated solutions offer device manufacturers reduced bill-of-materials costs, time-to-market, and development time. Mobile handsets powered by QCT chipsets can offer more features while maintaining a smaller, sleeker form-factor and benefiting from reduced power demands.
QCT values collaboration with its customers and partners and works closely with them to enable their success. We offer a wide range of tools to support the device development process, and develop new technologies based on the needs and demands of the wireless market. Devices for all market segments can now include features enabled by 3G wireless technology, in demand by a growing and increasingly sophisticated wireless community.

Job ID: 115161379

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