BS/MS in Mechanical, Electrical, Industrial, Chemical or Manufacturing Engineering with 5 to 6 years experience working in Printed circuit board assembly or with surface mount technology at a contract manufacturer or any related experience.
5+ years of experience in printed circuit assembly manufacturing processes.
Surface mount technology process knowledge including stencil printing, pick and placement process, reflow process, hotbar, robotic/laser soldering and ACF process.
Experience developing process quality plans, supplier quality audits, and driving corrective actions and failure analysis efforts.
Preferred Qualifications
Working knowledge of printed circuit board assembly (PCBA) reliability concepts, failure analysis techniques like EDX, SEM and FTIR.
Experience with the development and evaluation of various SMT processes
Project management experience and a deep understanding of problem solving tools including design of experiments, root cause analysis and statistical analytical tools
Experience with any of the following: packaging technology, chip scale or wafer level chip scale packaging technology, molding process, System in package construction
Effective communication skills with an ability to explain complex problems to a wide variety of technical and non-technical audiences
Good team player with an ability to work with multiple x-functional teams
