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Core Platform- Device driver development (BSP / Linux)- Engineer

2-7 Years
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Job Description

General Summary:

Join Qualcomm's Core Platform team, where your expertise in embedded systems and device driver development will drive innovation at the foundational layer of next-generation ARM-based SoCs. As an Engineer, Sr Engineer, or Lead Engineer (depending on experience), you will be responsible for the design, development, testing, and optimization of low-level drivers and bootloaders, contributing directly to Qualcomm's leadership in wireless, compute, and connected technologies.

Key Responsibilities:

  • Design and implement device drivers and Board Support Packages (BSP) for ARM-based SoCs running Linux.
  • Perform bring-up of new SoC platforms, including low-level hardware enablement and peripheral driver development.
  • Develop and execute unit tests to validate driver functionality and robustness.
  • Analyze and resolve bugs from system testing and field/customer feedback.
  • Optimize driver code for performance, memory, and reliability in embedded environments.
  • Work closely with hardware, firmware, and systems teams to understand requirements and support platform integration.


Required Skills & Experience:

  • 2–8 years of experience in device driver development and BSPs, ideally in embedded Linux environments.
  • Strong proficiency in C programming and a solid understanding of Linux kernel internals.
  • Proven experience in driver development for peripherals such as I2C, SPI, UART, GPIO, PCIe, USB, or Ethernet.
  • Experience with bootloader development (e.g., U-Boot) and platform bring-up on ARM SoCs.
  • Familiarity with ARM/DSP processor architecture, including JTAG and hardware debugging tools.
  • Experience with Yocto, QSDK, RDK-B, PRPL OS, or OpenSync is a strong plus.
  • Hands-on problem-solving and debugging skills using hardware debuggers and logic analyzers.
  • Excellent verbal and written communication and documentation skills.


Minimum Qualifications:

  • Bachelor's degree in Engineering, Computer Science, Information Systems, or related field.
  • Master's degree is preferred for senior/lead positions.
  • Strong academic foundation with proven ability in low-level systems software.

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About Company

QUALCOMM CDMA Technologies (QCT) is the largest provider of 3G chipset and software technology in the world, with chipsets shipped to more than 50 customers and powering the majority of all 3G devices commercially available. QCT partners with nearly 60 3G network operators around the globe and has the largest CDMA engineering team in the wireless industry.
QCT provides complete chipset solutions and integrated applications from the Launchpad suite of advanced technologies. Our integrated solutions offer device manufacturers reduced bill-of-materials costs, time-to-market, and development time. Mobile handsets powered by QCT chipsets can offer more features while maintaining a smaller, sleeker form-factor and benefiting from reduced power demands.
QCT values collaboration with its customers and partners and works closely with them to enable their success. We offer a wide range of tools to support the device development process, and develop new technologies based on the needs and demands of the wireless market. Devices for all market segments can now include features enabled by 3G wireless technology, in demand by a growing and increasingly sophisticated wireless community.

Job ID: 115165211

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