APD Package Design

Key Responsibilities

• Design IC packages using Cadence APD for high-performance applications
• Understand package/substrate design and assembly rules for flip chip designs
• Work with different package technologies such as MCM, flip chip/wire bond, 3D, 2.5D (added advantage)
• Design High-Speed Complex Packages and PCBs with HDI, Blind, and Buried Via technologies
• Create PCB designs involving high-speed parallel bus interfaces including DDR, GDDR, and HSIO (PCIe, SERDES)
• Execute stack-up design while adhering to DFM/DFA rules
• Set constraints and ensure compliance in layout tools