production readiness , power analysis, Design Reviews, Silicon Bring-up, PnR Implementation, Verification, Physical Design, Placement, Floor Planning, ASIC Design, Low Power Verification, Rtl Design

Technical Leadership, Soc, ASIC implementation, custom IP integration, physical design flows, custom silicon design, hardware-software co-design, mass production, system-level debug, silicon bring-up, SoC development programs, hardware-software co-design principles, root-cause analysis

clocking , Verilog, EDA tools for synthesis, LINT, Use of AI for design, cdc, SoC-level design and integration, Synthesis flows, Rtl Design, spyglass, VHDL, Verification methodologies, RDC, Digital design principles, Resets, Timing Constraints, Micro-architecture design, Low-power design techniques, Timing Analysis

high-performance datapath architecture, ASIC SoC architecture, congestion control, Traffic Management, SystemVerilog RTL design, advanced networking architectures, infiniband, collective communication acceleration, 1.6T Ethernet systems, AI HPC interconnects, RDMA packet processing, High-speed SerDes, UCIe, reliability mechanisms, PCIe Gen6, Ultra Ethernet, full ASIC lifecycle, RoCEv2, CXL, Ethernet Scale-Up Networking

Golang, Distributed Systems, Containers, Technical Leadership, Automation, File Systems, Microservices, Cloud Storage, Infrastructure Services, Databases, Gcp, Scalability, Rest Apis, Azure, Python, Kubernetes, AWS, Software Systems Engineering, Go, Security, Reliability, Observability

Die file generation, Feed-through planning, PnR implementation, SoC Full-chip floorplanning, PG creation and push-down methodologies, Hierarchical design implementation, Scripting flow deployment for SoC Blocks, Physical Verification, SoC RTL to GDSII implementation, RDL knowledge, Sta

C, Python, LabVIEW, SoC System-on-Chip, precision measurement techniques, voltage regulators, reference circuits, bench characterization of Analog Digital and Mixed-Signal IPs, Microcontrollers

Commercial New Product Development (NPD), Quality, Electromechanical System Architecture Integration, Customer Market Requirements Engineering, Field Failure Complaint Root Cause Analysis, Reliability, Manufacturing Transfer, Hardware Systems, Electromechanical Product Engineering, Product Launch