semiconductor packaging , thermal analysis , mold flow analysis, material characterization, assembly process integration, Back-End Assembly, Failure Analysis, EMC Epoxymoulding Compound, thermo-mechanical analysis, EMC material development, package reliability, reliability assessments

Agentic AI workflows, probe and test methodologies, Supplier Management, process control statistics, process integration, defect analysis, solid-state device physics, semiconductor metrology, Hardware, NAND DRAM integration, semiconductor process development optimization

Power Bi, Python, Solidworks, Tableau, process integration, Data Analysis, Optimization

3d packaging , Si Photonics based packaging design, wafer level packaging process flow, CST, statistical analysis tools, PowerSI, hybrid multi-chip integration, Momentum, SI-Wave, IE3D, hfss

SAP, Spss, Ms Office, MATLAB, Process Control Software, Teamcenter, Statistics

8d problem solving , QMS - ISO 9001, Sql, Excel, Reliability Engineering, Yield Analysis, Fmea, Defect Reduction, IATF 16949, Jmp, Capa, Minitab, Pfmea