Wire routing, Drafting, Dfmea, Component validation Qualification, Modeling using NX Tool, NUDD, TA, Tolerance stack-up

surface mount technology , tolerance analysis , Data Analysis, data correlation, wire bond, IC packaging, data distribution, Spc, mechanical simulation, material characterizations, Laser and sputter thin film materials, Mechanical Design, SiP process, design for experiments, panel level packaging process, semiconductor packaging component failure analysis, Printed Circuit board assembly process, wafer level packaging process, die attach, underfill, Molding, dicing saw, Cpk

tolerance analysis , 2D drawing, Fea, Mechanical Engineering, Dfmea, sheet metal manufacturing processes, Dfm

tolerance analysis , 2D drawing, Fea, Mechanical Engineering, Dfmea, sheet metal manufacturing processes, Dfm, Product Design

ECR, Dfmea, Good Logical thinking, Good Problem Solving Skills