About Us:
SpaceRelays is a space-tech startup founded by alumni from IIST (Thiruvananthapuram), NIT (Bhopal), and MIT (USA), building next-generation optical hardware systems for ultra-high-performance free-space optical communication in terrestrial and non-terrestrial applications. Backed by a successful pre-seed round, we are now expanding our core engineering team to accelerate R&D and product integration across photonic, electronic, and system-level domains.
Compensation- CTC: ₹20–25 LPA
- Fixed Salary: ₹12–15 LPA (based on experience and role)
- ESOPs: Included as part of total compensation
About the RoleWe are building next-generation optical communication systems leveraging advanced nanotechnology and high-density semiconductor platforms. Thermal stability is critical to performance, reliability, and overall system efficiency.
We are looking for a Thermal Engineer to join us and lead end-to-end thermal design for advanced nanotech and semiconductor systems.
You will independently drive simulation, design, and validation of thermal solutions for high-density and temperature-sensitive hardware.
The role requires strong experience in chip-level and nano-scale thermal management, with a hands-on approach to solving real engineering challenges.
We value engineers who can take ownership, work across disciplines, and deliver robust, production-ready thermal designs.
Key Responsibilities- Own thermal design and management for nanotech, semiconductor, and optical communication systems
- Perform thermal simulations (steady-state & transient) using tools like ANSYS Icepak, COMSOL, FloTHERM
- Design and optimize cooling solutions (heat sinks, TIMs, airflow, enclosures, passive/active cooling)
- Analyze thermal impact on system performance, reliability, and stability
- Work closely with electronics, packaging, and photonics teams
- Conduct thermal testing & validation (IR thermography, environmental testing, correlation with simulations)
- Develop thermal models, guidelines, and design best practices
- Identify and mitigate hotspots, thermal runaway risks, and long-term degradation issues
Experience Requirements- B.Tech / B.S. + 5 years of relevant experience
- M.Tech / M.S. + 3 years of relevant experience
- Ph.D. + 1 year of relevant experience
Required Qualifications- Strong fundamentals in heat transfer (conduction, convection, radiation)
- Hands-on experience with thermal simulation tools (ANSYS Icepak, COMSOL, FloTHERM, etc.)
- Experience in thermal management of electronics or semiconductor systems
- Proven ability to independently own thermal design and analysis
- Experience with PCB and high-density system thermal challenges
Preferred Qualifications- Experience with semiconductor / chip-level thermal management
- Exposure to nano-electronics or high heat flux systems
- Experience with Photonic Integrated Circuits (PICs) or optical modules
- Familiarity with thermal impact on lasers, optics, or RF systems
- Knowledge of materials, TIMs, and advanced packaging techniques
What We're Looking For- Strong ownership and ability to work independently end-to-end
- Deep problem-solving mindset with attention to detail
- Ability to collaborate across multidisciplinary engineering teams
- Comfortable working in a fast-paced, deep-tech environment
LocationApply Here - https://quaint-domain-5a0.notion.site/348d0ef9537e80889c69f1e597a35d54
