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3-5 Years
Not Disclosed

This job is no longer accepting applications

Job Description

We have a requirement for thermal simulation and find the JD below

  • Thermal Simulation for the characterization and development of power modules Flip chip BGA wire bond on package, board, and system level
  • Generation of simulation and compact models for end customers.
  • Thermal virtual prototyping and simulation-based product optimization.
  • Thermal consulting of internal customers from development and application; close interaction with customers from a problem statement to simulation results interpretation and delivery.
  • Working in close exchange with the multi-cultural team.

A degree in Mechanical / Electronics Engineering, Physics, or a similar field

At least 3-5 years of professional experience in thermal FEM/ CFD simulations

Very good hands-on experience with Ansys workbench, Icepak, AEDT

Knowledge in creating and modifying 3D CAD geometries for simulation.

More Info

Job Type:
Function:
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Key Skills

AEDT

3D CAD geometries

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