Thermal Engineer

We have a requirement for thermal simulation and find the JD below

• Thermal Simulation for the characterization and development of power modules Flip chip BGA wire bond on package, board, and system level
• Generation of simulation and compact models for end customers.
• Thermal virtual prototyping and simulation-based product optimization.
• Thermal consulting of internal customers from development and application; close interaction with customers from a problem statement to simulation results interpretation and delivery.
• Working in close exchange with the multi-cultural team.

A degree in Mechanical / Electronics Engineering, Physics, or a similar field

At least 3-5 years of professional experience in thermal FEM/ CFD simulations

Very good hands-on experience with Ansys workbench, Icepak, AEDT

Knowledge in creating and modifying 3D CAD geometries for simulation.