SOC Thermal engineer

• Plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems for cutting-edge products.
• Collaborate with cross-functional teams to develop solutions and meet performance requirements.
• Develop SoC thermal analysis methodologies encompassing SoC, package, and systems for various Qualcomm products (smartphones, laptops, automotive, VR headsets).
• Develop strategies to predict and improve thermally constrained scores (e.g., AnTuTu/Geekbench).
• Measure and tune thermal performance on post-silicon platforms, including infrared imaging.
• Improve thermal mitigation strategies through power and thermal management to achieve optimal system thermal performance.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Skills:

• Strong analytical skills and mathematical modeling abilities.
• Knowledge of SoC stack-up is essential.
• Good knowledge of scripting in PERL/Python is required; some exposure to Machine Learning algorithms/frameworks is a plus.
• Thorough knowledge of heat transfer mechanisms and Computational Fluid Dynamics (CFD).
• Proficiency with state-of-the-art thermal analysis tools (e.g., Ansys Icepak/Flotherm).
• Thermal measurement skills will be preferred.