Senior Manager, Systems Engineer

The Senior Manager, Systems Engineering will lead the Singapore-based Systems Engineering team within Applied Materials Advanced Packaging business. This role is responsible for driving the development of next-generation semiconductor equipment, leading cross-functional engineering programs, and building regional technical capabilities to support global R&D and product roadmaps.

Key Responsibilities

• Lead and develop a high-performing Systems Engineering team supporting new product development and sustaining engineering activities.
• Drive system architecture, electrical design, controls integration, and qualification of semiconductor equipment for advanced packaging applications.
• Lead cross-functional programs from concept through product release, ensuring delivery of performance, quality, cost, and schedule objectives.
• Partner with global R&D, Product Management, Manufacturing, and Field organizations to develop and commercialize innovative technology solutions.
• Drive continuous improvement, controls modernization, and product enhancement initiatives across existing and next-generation platforms.
• Ensure compliance with SEMI, safety, electrical, and regulatory requirements.
• Develop organizational capability through talent acquisition, coaching, succession planning, and employee development.
• Manage departmental priorities, resources, and budgets to support business objectives.

Minimum Qualifications

• PhD, Master's Degree or Bachelor's degree in Electrical Engineering, Systems Engineering, Mechatronics, or a related technical discipline.
• 12+ years of experience in semiconductor equipment, semiconductor manufacturing, or related high-technology industries.
• 5+ years of engineering leadership experience managing technical teams and complex development programs.
• Proven track record in system design, product development, and commercialization of semiconductor equipment.
• Strong expertise in systems engineering, electrical controls, automation, equipment integration, and problem solving.
• Experience in Advanced Packaging, Hybrid Bonding, PVD, Etch, Thermal Processing, Metrology, or related semiconductor technologies.

Work Location

• Science Park II (Moving to Tampines office from mid-2027)