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About Us:
Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3200+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs.
Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve's design services include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP, and foundries. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others. Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial and Medical segments.
Tessolve's Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities.
Tessolve's clientele includes Tier 1 clients across multiple market segments, 9 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence over 12 countries with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, Canada, UK, Japan, Taiwan, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose.
For more details, visit https://www.tessolve.com/
Job Overview
This Product Engineer / Lead will drive new product development from design through high-volume production, coordinating cross-functional teams to ensure validation, yield, and manufacturing readiness. The role requires strong statistical analysis, test and failure-analysis collaboration, and development of efficient manufacturing tests to meet quality standards in the semiconductor industry. Location not specified; role supports global teams and multi-site coordination.
Job Designation: Product Engineer / Lead
Years of Exp: 1 to 8 years
Job Location: Bangalore
What you'll do
Who you are
Job ID: 148277157
Skills:
V93K, Jmp, Exensio, yield analysis, JEDEC and AECQ100
Skills:
semiconductor packaging , Ms Office, automation, Statistical Analysis, Jmp, Npi, Fmea, Spc, design review processes, APQP, discrete device testing, Power Electronics, engineering databases, wafer level processing, assembly and test methods, Semiconductor Manufacturing, yield engineering
Skills:
tolerance analysis , Solidworks, design of experiments, servo motors, PC-based control systems, measurement processes, optics principles, automation equipment, Plc, Nx, Pneumatics, Jmp, SCARA, Failure Analysis, Minitab, 6-axis, CCD cameras, Robotics, precision assembly, motion controllers, Six Sigma, 1D lasers, Proe
Skills:
SAP, CAD software, Excel proficiency, Autocad, IMOS, ERP systems
Skills:
Lotus Notes, SAP, Flowcharting, Excel, TcE Core, Powerpoint, Creo PDM, Ms Word, Nx, P Cad E3S
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