Process Integration Engineer

Role

• Develop and optimize semiconductor process flows for SiC and GaN power devices in collaboration with external foundries.
• Support integration of key fabrication processes including epitaxy, ion implantation, oxidation, annealing, dielectric deposition, lithography, etching, metallization, and passivation.
• Plan and execute Design of Experiments (DOE) to optimize process performance and manufacturability.
• Analyze inline process data, electrical characterization, and wafer acceptance results to improve process capability.
• Investigate process-related issues and support root-cause analysis of process excursions.
• Collaborate with Device Design engineers to ensure successful implementation of new device structures.
• Support technology qualification and production release activities.
• Contribute to process documentation, specifications, and process control methodologies.
• Work closely with foundries, device design and reliability teams, and product engineering during technology development and product ramp-up.

Requirements

• MS/PhD in Electrical Engineering, Materials Science, Semiconductor Physics, or a related discipline.
• 4–8 years of experience in semiconductor process integration or process development.
• Good understanding of semiconductor fabrication processes and process integration.
• Experience with DOE planning, statistical data analysis, and process optimization.
• Experience in JMP, Minitab, or other statistical tools.
• Familiarity with semiconductor process monitoring and electrical characterization.
• Understanding of semiconductor defects, yield improvement, and process variation.
• Experience working with external wafer foundries is preferred.
• Knowledge of JEDEC and AEC-Q101 qualification standards is desirable.
• Strong analytical, problem-solving, and communication skills.