Process Engineering

Role Overview

Process SME is responsible for overseeing, optimizing & continuously improving processes to ensure on-time manufacturing with high quality of all ISP Products. Also to handle end to end machine setup , programming , trouble shooting and process optimization in PCB assembly

The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams.

Responsibilities

• Technology & Process Setup
• Define and maintain all process windows, control plans & CTQ across all products of PnP.
• Setup, Operate, Programming & Optimizing PnP machines.
• Conduct DOE & Process validation for new products and materials.
• Perform feeder loading , nozzle selection & calibration.
• Optimize component placement accuracy and speed.
• Create & modify machine programs using online/offline SW.
• Optimize cycle time and improve placement efficiency.
• Perform Penalization and coordinate transformation.
• Validate BOM , Centroid file and Gerber data before production.
• New Model Readiness
• Develop & Maintain Process documentation, WIs & SOPs (Pick n Place / Mounter, SPP, AOI,STI, Reflow)
• All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation.
• Load & verify machine programs for New Product Trail.
• Conduct First Article Inspection.
• Partner with NPI, TDG to ensure DFMEA and PFMEA of Pink n Place / Mounter,SPP, AOI,STI, Reflow.
• Ensure proper solder paste reflow per component and PCB design requirements
• Ensure smooth technology transfer from development to production.
• Own ramp-up metrics: yield learning curve, cycle time, scrap reduction.
• Quality Excellence
• Accountable for first pass yield, final yield and field reliability.
• Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis.
• Monitor production yield , defect rates , cycle time and implement corrective / preventive actions.
• Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints, misalignment , missing components and solder balls.
• Partner with Quality team to address customer returns, audits and escalations.
• Analyze following defects ( Identify root causes of defects like tombstoning , misalignment , missing components etc. ) and implement corrective actions
• Monitor Placement Quality and defect rates.
• Maintain Process documentation & Production reports.
• Operational Excellence & Cost Optimization
• Own cost of ownership and productivity improvement initiatives.
• Drive Cycle time and line balancing improvements.
• Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing )
• To ensure Proper line setup , programming , Program version management ( Pick n Place/Mounter )
• To ensure compliance with ESD , Safety& IPC standards.
• Meet daily production targets & OEE goals
• Coordinate with production planning , quality & maintenance teams
• Diagnose and resolve machine alarms and placement defects
• Handle feeder related issues , vision alignment errors & nozzle problems
• Minimize downtime & improve machine utilization
• Customer & Stakeholder Engagement
• Serve as a technical team member for customers on PCBA Process Topics.
• Will be technical team member for customer reviews, technology discussions and risk mitigation plans.
  
  

Key Deliverables & KPI

• First Pass Yield , RTY and Reliability Performance
• Productivity Improvement , Production Target Vs Actual Achievement
• Cost Optimization
• Customer satisfaction and Audit outcomes.
• Placement Accuracy
  
  

Education Qualifications

• Bachelor in related Engineering Discipline (Preferred Electronics Engineering)
• 10-12 years hands on experience in SMT industry in a similar role ( PnP Programming & Optimization )
• Experience in high volume manufacturing environment.
• Hands on knowledge of PnP machines ( ASMPT / Fuji / Panasonic )
• Deep Understanding of solder paste behavior & thermal profiling
• Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE )
• Familiar with Lean manufacturing
• Strong knowledge of SMT Process Flow