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Position: Principal Product Engineer
Grade: T4
Location: Bangalore
Experience: 7-10 Yrs
Job Description
This position presents an exciting opportunity within Cadence's Digital and Signoff Group (DSG) for a Product Engineer. In this dynamic environment, you'll collaborate closely with R&D, Application Engineering & product marketing teams to help drive the development of advanced chip design software tools. Your responsibilities will include:
Provide place-and-route expertise to both Cadence customers and internal development teams
PPA benchmarking on customer and foundry test cases
Evaluate impact of new features on PPA
Be a liaison for new features between customer/foundry and R&D development teams
Develop point solutions with scripting
Data mining and analysis to uncover PPA limiting issues and identify optimization opportunities
Minimum Qualifications:
A Bachelor or Master's degree in EE/CS or equivalent major (Masters level preferred)
A minimum of 7 years of hands on experience with any industry standard place-and-route tools (5 years with Master Degree)
A good understanding of the RTL-GDSII flow
A good understanding of the PDK and DK collaterals
Firm understanding of Timing and power analysis
Good scripting skills
Job ID: 147675487
Skills:
Tcl, Python, Perl, routing, Synthesis, ASIC design flow, Timing Analysis, PPA optimization, EDA Tools, Placement, signoff, Timing Closure, RTL-to-GDSII
Skills:
routing, Perl, Python, Tcl, ASIC design flow, Synthesis, Timing Analysis, signoff, EDA Tools, Timing Closure, Placement, PPA optimization, RTL-to-GDSII
Skills:
Test Plan Creation, Automation Frameworks, Pcie, Nvme, Programming and scripting languages, System Design of SSD, Debugging and problem-solving skills, Verification and validation methodologies, Testbench architecture, NAND, Simulation and emulation environments
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