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Job Responsibilities
Enable technology ramp in high-volume production for CMOS and memory devices.
Improve device performance with a focus on variability reduction and robustness.
Support and execute design and test optimisation to enhance manufacturability and performance.
Identify and implement process simplification and working methodology improvements.
Lead or actively contribute to cross-functional problem-solving for device, yield, and quality issues.
Job Requirements
Minimum 5 years of relevant working experience is required. A master's or Ph.D. degree in Physics or Engineering areas is preferred.
Working experience in wafer fab process or process integration engineering. Direct experience in advanced CMOS device technology such as FinFET or GAA is preferable.
Proven knowledge in semiconductor physics and understanding of transistor operations, scaling limitations and reliability, basic knowledge of CMOS circuits and characterisation methods.
Understanding of wafer fabrication process areas, including tool sets, process mechanisms, tuning knobs, etc.
Excellent data analysis skills using software (JMP, SPOTFIRE, etc).
Strong task ownership, self-motivated to work with other team members to make progress collaboratively.
Open-minded attitude to learn new skills and could adapt to a new working environment swiftly.
Good digital literacy with MS Office. Programming capability such as Python is a plus.
Occasional international business travel is required for this position.
Job ID: 153610655
Skills:
Ms Office, Python, CMOS Circuits, FinFET, semiconductor physics, GAA, characterisation methods, wafer fab process, transistor operations scaling limitations, advanced CMOS device technology, wafer fabrication process, process integration engineering
Skills:
Ms Office, AI coding, Jmp, data science basics, Statistical Process Control, plasma dry etch reactors, Python coding, plasma chemistry, SAS software, surface phenomena, plasma physics, dry etch process development