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Memory & Data-Movement / Chiplet Architect

Memory & Data-Movement / Chiplet Architect

Randstad Sourceright
  • Posted 17 hours ago
  • Be among the first 10 applicants

Job Description

Position: Memory & Data-Movement / Chiplet Architect (IRT712ST RM 4408)

Position Summary

Develop models and architecture studies for HBM, DDR, CXL memory, and system-level data movement in AI infrastructure.

Work mode : Hybrid

Education : B.E. / B.Tech / M.E. / M.Tech in Electronics, Electrical, Computer Engineering, or related discipline.

Key Responsibilities

  • Memory / Data-Movement Modelling: Develop functional/ performance models for HBM/DDR/memory subsystems; model memory bandwidth, latency, and access patterns; model DMA and high-volume data movement; analyze buffering, queues, and traffic patterns; evaluate CXLbased memory architectures.
  • Multi-Chiplet / Multi-XPU Scalability: Analyze memory scaling with multiple XPUs/chiplets, study aggregate bandwidth requirements, and identify memory bottlenecks in multi-XPU configurations.
  • System Performance & Architecture Exploration: Perform memory architecture trade-offs, evaluate bandwidth vs. latency vs. capacity, and correlate memory behavior with AI workload requirements.

Required Technical Skills

  • HBM / DDR.
  • 7–12+ years of semiconductor/system architecture experience.
  • Memory controllers.
  • Data movement / DMA.
  • SystemC/TLM.
  • C++ / Python.
  • AI/HPC system architecture.

Preferred Skills

  • Chiplet architecture, UCIe, PCIe.
  • Cache/coherency.
  • HBM2E / HBM3 / HBM3E.
  • AI accelerator architecture.

Project Experience : Hands-on memory/data-movement architecture or modelling work on HBM, DDR, or CXL-based memory systems.

Soft Skills

  • Strong quantitative reasoning across bandwidth, latency, and capacity trade-offs.
  • Ability to correlate memory-subsystem behavior with AI workload requirements for non-memoryspecialist stakeholders.

Good to Have

  • Direct HBM2E/HBM3/HBM3E architecture or modelling experience.
  • Exposure to cache/coherency design in a multi-chiplet system.

Expected Deliverables

  • Functional/performance models for HBM/DDR/CXL memory subsystems.
  • Memory scaling analysis across multi-XPU/chiplet configurations.
  • Memory architecture trade-off studies (bandwidth vs. latency vs. capacity).

Growth Path : Progress into Principal Memory Architect or Memory Subsystem Practice Lead roles.

More Info

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Key Skills

AI HPC system architecture

Data movement DMA

SystemC TLM

HBM DDR