Processed basic technical knowledge in die bonder machine setup and troubleshooting.
Minimum 0 - 2 years of experience in semiconductor production.
Preferably with 2 years of hands-on experience in machine set-up and troubleshooting of die attach bonder.
Must be willing to work in a cleanroom environment: wearing jumpsuits, a safety helmet, and safety shoes (only at the customer site)
Freshers may consider applying for this posting
Able to travel overseas / across India whenever needed.
Strong process orientation.
Good Initiative & follow-up.
Great problem-solving skills.
Solid communication and interpersonal skills that enable effective interaction in a diverse group of professionals.
Proficient in using standard office software tools, including MS Word, Excel, PowerPoint, Outlook, etc. Experience using 3D CAD design software is a plus.
Will be placed in the Bangalore area, and should be able to relocate upon request.
Responsibilities:
Performs machine and process setup of die attach machines
Able to perform machine troubleshooting.
Performs mechanical alignment when necessary
Ensure that the equipment is installed at the customer's place on schedule
Work with Cross-functional Departments to resolve function, safety, quality and productivity-related issue and improvements.
