About role:
Are you passionate about semiconductor packaging and advanced package substrate design Join our team and work on cutting-edge technologies supporting next-generation high-performance computing, networking, AI, and consumer semiconductor products.
Key Responsibilities
- Design and develop IC package substrates for advanced semiconductor packages (FCBGA, FCCSP, SiP, Flip-Chip)
- Create substrate layouts including bump maps, ball maps, stack-ups, escape routing, and high-speed signal routing
- Perform package routing while considering Signal Integrity (SI), Power Integrity (PI), and manufacturability
- Collaborate with cross-functional teams including IC, PCB, SI/PI, mechanical, and manufacturing engineers
- Generate fabrication outputs and ensure design compliance through DRC and design reviews
Required Skills
- Experience in IC Package Substrate Design and package layouts
- Hands-on expertise with Cadence Allegro Package Designer (APD) or APD+
- Strong knowledge of FCBGA, FCCSP, Flip-Chip, Wire Bond, SiP, and substrate technologies
- Good understanding of Signal Integrity (SI), Power Integrity (PI), PDN, and package manufacturing processes
- Familiarity with interfaces such as DDR/LPDDR, PCIe, USB, Ethernet, SerDes, or HBM is preferred.
Preferred Qualifications
- Bachelor's or Master's degree in Electronics, Electrical Engineering, VLSI, or a related fie
- 7+ years of experience in semiconductor package substrate design
- Strong analytical, debugging, and communication skills
