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As a member of Qualcomm Customer engineering team, the individual will be responsible for successful integration of Qualcomm solution into customer end products in Mobile, PC, IoT, Automotive and consumer electronics markets.
Experience in designing industry Standard form factor modules like SMARC, COM Express, COM HPC, Single Sided LGA, OSM etc
Proficient in schematic capture tools like OrCAD and Siemens Mentor Graphics Designer.
Proficient in PCB layout tools like Cadence Allegro and Siemens Mentor Graphics Expedition.
Proficient in Power Distribution Network (PDN) methodologies and schemes.
Proficient in routing topologies for PC-DDR, DDR, and termination schemes.
Proficient in routing schemes of high-speed interfaces like USB 3, PCIe 3+, Ethernet (1 Gbps or higher) and other SERDES interfaces
Knowledge of high-speed simulation tools like Ansys Q3D, Cadence Sigrity, and Sentinel is necessary
Candidates should have excellent communication skills (oral and written), to handle external customers across the geographies
Hands on knowledge of running PDN (power distribution network) simulations of a PCB is desired
Experience in analog, power, digital, and RF PCB layout aspects.
Hands-on experience with multilayer PCBs (at least 12 layers, at least 10 cm x 10 cm, with a processor or FPGA having > 500 pins and pitch smaller than 0.5 mm) and upto 2.00mm thickness.
Knowledge of PCB layout tools like Altium Designer and Mentor PADS is a plus.
Knowledge of thermal impacts and mechanical constraints on a PCB.
Experience in documenting PCB guidelines, checklists, and rules. Candidate should have 5-8 years of relevant experience. Past expertise in interacting with multiple teams in HW, domain skills in Digital/High Speed/SoC is desirable.
Candidates should be proficient in reviewing schematics & PCB layout of customer designs, in accordance with Qualcomm and general electrical guidelines and checks
Hands-on with electrical test & measurement equipments like oscilloscopes, power supplies, multimeters, data loggers are a plus
Exposure to general purpose prototyping platforms like Arduino, Raspberry Pi are a plus
Preferred Qualifications
Sound understanding of HW and PCB design.
Strong understanding of signal integrity and electromagnetic compatibility (EMC) principles.
Experience with Design for Manufacturability (DFM) and Design for Testability (DFT) practices.
Familiarity with IPC standards for PCB design and manufacturing.
Ability to perform design reviews and provide constructive feedback.
Excellent problem-solving skills and attention to detail.
Effective communication skills for collaborating with cross-functional teams.
Ability to manage multiple projects and meet deadlines.
QUALCOMM CDMA Technologies (QCT) is the largest provider of 3G chipset and software technology in the world, with chipsets shipped to more than 50 customers and powering the majority of all 3G devices commercially available. QCT partners with nearly 60 3G network operators around the globe and has the largest CDMA engineering team in the wireless industry.
QCT provides complete chipset solutions and integrated applications from the Launchpad suite of advanced technologies. Our integrated solutions offer device manufacturers reduced bill-of-materials costs, time-to-market, and development time. Mobile handsets powered by QCT chipsets can offer more features while maintaining a smaller, sleeker form-factor and benefiting from reduced power demands.
QCT values collaboration with its customers and partners and works closely with them to enable their success. We offer a wide range of tools to support the device development process, and develop new technologies based on the needs and demands of the wireless market. Devices for all market segments can now include features enabled by 3G wireless technology, in demand by a growing and increasingly sophisticated wireless community.
Job ID: 115056195
