We are seeking a Hardware design engineer/Semiconductor Engineer with deep expertise in Memory Technologies to support the definition, selection, qualification, and lifecycle management of memory components used in next-generation automotive ECUs (e.g., Central/Edge compute, infotainment, telematics, gateways). The role will contribute to semiconductor governance, technology roadmap decisions, and risk mitigation to ensure robust supply continuity and platform capability.
This position requires strong hands-on understanding of DRAM (LPDDR4/5), NAND (UFS/eMMC), and NOR (QSPI/OSPI) technologies and how memory choices impact performance, boot time, endurance, reliability, and qualification for automotive programs.
Drive the HW architecture and electronic component selection/decision for the next generation IVI, Telematics, Zonal ECUs.
Key Responsibilities
1) Memory Technology Strategy & Roadmap
- Drive memory technology evaluations and recommendations across ECU platforms, aligning with broader semiconductor strategy and platform needs.
- Provide technical inputs for compute/memory/package technology direction and vendor roadmap alignment.
2) Component Selection, Technical Ownership (RFI/RFQ/RFC)
- Own technical assessment for memory components during RFI/RFQ/RFC cycles, including trade studies on density, interface, performance, power, endurance, and cost.
- Support platform HW architecture and component selection decisions where memory is a key enabler (e.g., infotainment, telematics/connectivity, secure gateway).
3) Qualification & Validation Support (Automotive Readiness)
- Coordinate and support memory qualification activities across system and supplier ecosystems (PVL/qualification)
- Provide technical support for integration readiness, including interface compliance, throughput, latency, and compatibility topics with SoC/OS stacks.
4) Risk Assessment, Supply Continuity, PCN/EOL/NRND
- Execute and/or contribute to semiconductor risk analysis for BOM parts, including NRND/EOL/Legacy/LOA tracking and mitigation actions, in alignment with internal risk management practices.
- Lead technical mitigation options such as alternate part recommendations, dual sourcing, fab/assembly risk mitigation, and controlled transition planning when PCNs occur.
5) Supplier Technical Engagement (Tier-1/Tier-2/Chipmakers)
- Lead technical deep dives with memory suppliers and ecosystem partners; drive alignment on roadmap, quality, and change management.
- Collaborate with internal stakeholders across engineering, purchasing, supply chain, and vehicle teams to close gaps quickly.
Required Technical Expertise:
- Memory Technologies
- Strong hands-on knowledge of:
- UFS / eMMC (NAND managed flash) behavior, endurance concepts, firmware considerations, qualification readiness.
- QSPI / Octal SPI NOR for boot/code storage and XIP style use cases, plus addressing/architecture constraints in embedded platforms.
- LPDDR/DRAM sizing and performance implications for compute platforms.
- Automotive & Quality Context
- Familiarity with automotive expectations and qualification culture, Functional Safety, Automotive Cyber security requirements.
- System-Level Engineering Mindset
- Ability to connect memory choices to:
- boot time, throughput, latency, thermal/power, reliability and lifecycle risk
- platform constraints (SoC interface support, OS stack needs)
Basic Qualifications
- B.E/B.Tech or M.E/M.Tech in Electrical/Electronics, Telecommunication, or equivalent Engineering
- Minimum 8+ years of experience in automotive embedded electronics designs or hardware/system architectural role.
- Knowledge of Telematics unit, Automotive vehicle connectivity systems and ECU design, development, and testing.
- Strong teamwork spirit, excellent oral and written communication skills.
- Proven ability to communicate effectively with global teams.
Preferred Qualifications
- Experience in automotive area (TIER1, TIER2)
- Experience in ZCU/IVI/Telematics/connectivity modules, GPS, GNSS, Wi-Fi, BLE, NFC, UWB technologies.
- Basic understanding of Board software/Bring up software.
- Knowledge of safety standards including ISO 26262, Euro NAP, and Security regulations would be a plus.
