Foundry Device Engineer, SiC

Key Responsibilities and Duties

Device Design & Simulation

• Design and layout SiC and GaN power devices for new product introductions, in collaboration with external foundry partners.
• Run TCAD and compact-model simulations to predict device performance across process, voltage, and temperature corners.
• Define device targets, design margins, and layout rules that hold up against process variability in volume production.
• Translate simulation and silicon results into design revisions, and drive those changes through foundry tape-out cycles.
  
  

Process Control & Yield Improvement

• Monitor product and process performance throughout the manufacturing lifecycle using statistical and electrical data.
• Support yield optimization initiatives through DOE, process characterization, and root-cause investigations, and assist with corrective action.
• Help define and implement process control plans, SPC monitoring, Cpk/Ppk tracking, and manufacturing health indicators.
• Identify and resolve yield, reliability, and device performance issues in collaboration with foundry and cross-functional teams.
  
  

Device Engineering & Reliability

• Analyze electrical, process, reliability, and parametric data to improve product performance, manufacturability, and process robustness.
• Support qualification, reliability assessments, and failure-analysis investigations for SiC and GaN technologies.
• Partner with Product Engineering and Test Engineering on screening strategies, guard bands, yield limits, and excursion management.
• Evaluate foundry PCNs, process improvements, and technology changes to determine product impact and qualification requirements.
  
  

Foundry Engagement

• Engage with external foundry partners to build a working understanding of their process technology, capabilities, and constraints.
• Participate in regular technical reviews with foundries covering process health, yield trends, and reliability performance.
  
  

Qualifications

Required Qualifications

• B.S. or M.S. in Electrical Engineering, Semiconductor Engineering, Materials Science, Physics, or a related technical field.
• 2–5 years of semiconductor device, process, product, or foundry engineering experience.
• Hands-on experience with IC layout tools such as Cadence Virtuoso.
• Experience with TCAD simulation, device characterization, and power device modeling.
• Strong understanding of power semiconductor device physics and manufacturing processes.
• Experience analyzing electrical, parametric, process, yield, and reliability data to make data-driven decisions.
• Excellent communication skills with the ability to collaborate effectively across global, cross-functional organizations.
  
  

Preferred Qualifications

• Experience with SiC and/or GaN technologies.
• Direct experience working with wafer foundries or external manufacturing partners.