BITSILICA - Senior Physical Design Lead/Manager - SoC/RTL

5-7 Years

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Early Applicant

Job Description

Key Responsibilities

Lead SoC/IP physical implementation through all stages of the RTL-to-GDSII flow for advanced nodes (7nm and below).
Drive PPA (Power, Performance, Area) optimization at block and top levels.
Own floorplanning, placement, CTS, routing, and signoff activities to meet design targets.
Perform STA, IR/EM analysis, and integrate power intent using UPF.
Ensure full physical verification (DRC/LVS) closure using industry-standard EDA tools.
Manage ECO implementation, timing closure, and final tapeout preparation.
Guide and mentor a team of physical design engineers; provide technical leadership throughout the project lifecycle.
Work closely with RTL, DFT, synthesis, verification, and architecture teams to resolve cross-functional issues.
Prepare project plans, track execution, and ensure delivery milestones are met.
Identify and implement flow improvements, automation, and best practices for efficiency.

Required Skills & Experience

Strong hands-on experience in RTL-to-GDSII flow at advanced process nodes (7nm, 5nm, 3nm preferred).
Expertise in floorplanning, placement, CTS, routing, and signoff methodologies.
Proficiency in:
STA (Static Timing Analysis)
IR/EM analysis
Physical verification (DRC/LVS)
Power analysis
Hands-on experience with leading EDA tools such as:
Cadence Innovus
Synopsys PrimeTime
Mentor/Siemens Calibre
Strong scripting skills in TCL, Perl, Python for flow automation.
Experience with UPF for power intent implementation.
Solid understanding of SoC architecture and block/top-level implementation practices.
Excellent problem-solving, communication, and team leadership skills.

Preferred Qualifications

Prior experience leading multiple successful tapeouts.
Knowledge of advanced packaging, multi-die integration, or chiplet-based design.
Exposure to cloud-based EDA workflows.

(ref:hirist.tech)