About Axiro Semiconductor
Axiro Semiconductor is a fabless semiconductor design company headquartered in Bengaluru, driving innovation in RF, wireless infrastructure, satellite communication (Satcom), and high-speed connectivity solutions. Backed by CG Power & Industrial Solutions Ltd. part of the 120-year-old Murugappa Group. Axiro represents India's leap into the global semiconductor arena. With millions of chips already powering global networks, a world-class team across India, the US, and Europe, and cutting-edge expertise spanning RF, mmWave, GaN, and next-generation communication technologies, Axiro is engineering the future of how the world connects, computes, and communicates.
For more information, please visit: www.axiro.com
Key Responsibilitie
- sCockpit System Architecture: Define and support end-to-end automotive cockpit solutions including infotainment, digital instrument clusters, HUD, and multi-display systems
- .HW/SW Integration: Work closely with silicon, BSP, middleware, and application software teams to integrate hardware and software components into complete cockpit platforms
- .OS & BSP Development: Support Linux, QNX, and Android Automotive platforms, including kernel, middleware, device drivers, bootloaders, power management, and memory initialization
- .SoC Bring-Up: Lead or support early silicon and board bring-up activities, including BSP customization and platform stabilization
- .Peripheral Integration: Integrate and debug peripherals such as display controllers, GPUs, touch controllers, audio DSPs, connectivity modules, USB, CAN, Ethernet, and PCIe
- .Graphics & Multimedia Optimization: Debug and optimize graphics pipelines, video playback, camera inputs, audio synchronization, and overall system performance
- .Networking & Communication: Support automotive networking technologies including Automotive Ethernet, SOME/IP, CAN, and related communication stacks
- .Performance, Power & Thermal Optimization: Diagnose and resolve complex system issues related to performance bottlenecks, stability, power consumption, and thermal constraints
- .Reference Designs & Demos: Develop and support reference designs, evaluation kits, and demos to enable customer design-in and sales engagement
- .Customer Engagement: Act as a technical interface to automotive OEMs and Tier1 customers during system integration, debug, and qualification phases
- .Cross-Functional Collaboration: Work closely with architecture, validation, product, and marketing teams to ensure solution readiness and product success
- .Documentation & Training: Create technical documentation and deliver training for customers and internal teams
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Qualificatio
- nsEducation: Bachelor's degree in Electrical Engineering, Computer Engineering, or related field; Master's degree preferre
- d.Experience: 5+ years of experience in automotive systems, embedded platforms, or semiconductor applications engineerin
- g.Operating Systems: Hands-on experience with Linux, QNX, or Android Automotive OS internals, including kernel, middleware, and device driver developmen
- t.BSP & Bring-Up: Strong understanding of SoC bring-up and BSP development, including bootloaders, power management, and memory initializatio
- n.Peripherals & Interfaces: Proven experience integrating displays, GPUs, touch, audio, connectivity, USB, CAN, Ethernet, and PCIe for infotainment system
- s.Debug Expertise: Demonstrated ability to debug complex issues related to graphics performance, audio synchronization, system stability, and power/thermal behavio
- r.Automotive Networking: Experience with Automotive Ethernet, SOME/IP, and in-vehicle communication stack
- s.Automotive Standards: Familiarity with automotive development processes and standards (ISO 26262, ASPICE, AECQ
- ).Customer-Facing Skills: Strong ability to support OEM and Tier1 customer engagement
- s.Communication: Excellent verbal and written communication skill
- s.Problem-Solving: Strong analytical and system-level debugging skill
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