Develop and execute Computational Fluid Dynamic (CFD) and thermal simulations for electronics cooling applications, including airflow, forced and natural convection, and conjugate heat transfer
Support component-, board-, enclosure-, cabinet-, and sub-system–level thermal analysis for products such as circuit breakers, PLCs, laptops, and appliances
Analyze industrial environments (EIA) including high ambient temperatures, enclosure heating, dust effects, and derating requirements
Assist in rapid model setup and simulation turnaround to support internal service requests and customer engineering needs
Apply appropriate boundary conditions including power losses (I²R, switching losses), contact resistance, and environmental loads
Support steady-state and transient thermal analyses, including power cycling, duty cycles, startup conditions, and basic fault scenarios
Evaluate airflow distribution in control panels, switchgear assemblies, and electronic enclosures
Post-process and interpret simulation results to identify thermal risks, hotspots, airflow inefficiencies, and design improvement opportunities
Assist in correlating simulation results with temperature rise tests, lab measurements, and field observations
Prepare clear technical summaries and documentation of assumptions, methods, results, and limitations
Support verification and validation (V&V) activities, including comparison with test data using engineering metrics
Engage with senior engineers to understand UL/IEC standards, certification requirements, and temperature rise limits
Learn and apply best practices in mesh strategy, numerical stability, convergence assessment, and result credibility
Support design optimization activities such as heat sink sizing, airflow path improvement, and enclosure ventilation strategies
Collaborate effectively with cross-functional teams (electrical, mechanical, regulatory) and contribute to a learning-oriented, supportive team culture
Qualifications
Bachelor's or Master's degree in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, or a related field from a reputed institution
4–8 years of industrial or applied experience in Computational Fluid Dynamic (CFD) and thermal-fluid simulations (internships and thesis work may be considered)
Strong fundamentals in:
Fluid mechanics and basic turbulence modeling
Heat transfer (conduction, convection, radiation)
Thermodynamics relevant to electronics cooling
Hands-on exposure to CFD model setup, solution execution, and result interpretation
Familiarity with at least one commercial simulation tool such as:
ANSYS Icepak, ANSYS Fluent
Siemens FloTHERM / FloEFD
STAR-CCM+, COMSOL, or similar software
Basic understanding of mesh generation and grid quality concepts, solver settings and convergence behavior
Structured modeling workflows and technical guidelines
Good written and verbal communication skills, with ability to explain results clearly
Self-motivated, detail-oriented, and comfortable learning in a technically rigorous environment
Exposure to electronics thermal management, including:
ICs, PCBs, power electronics
Heat sinks, fans, vents, and enclosures
Awareness of electronics packaging constraints such as:
Space limitations, airflow resistance
Material properties and power dissipation
Basic experience with thermal testing, such as thermocouple placement, temperature measurement, or data acquisition
Introductory experience correlating simulation results with test or experimental data
Familiarity with transient thermal behavior, power cycling, and reliability considerations
Exposure or interest in industrial products such as circuit breakers, PLCs, switchgear, or control panels
Interest in automation, scripting, or AI-assisted simulation workflows
