Title: 3D-IC Methodology Architect
About GlobalFoundries
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Summary Of Role
This role describes an experienced 3D-IC methodology architect - develop design & verification methodology, lead technical team, drive standards across organization, vendors and technical focus on EMAG, thermal & package flows for multi-die systems. The successful candidate is required to have experience in technically leading teams, specifying and scoping methodology work items, collaborating with internal and external partners, and mentoring junior colleagues.
Essential Responsibilities
- 3D-IC architect - develop design & verification methodology, lead technical team, drive standards across organization, vendors and technical focus on EMAG, thermal & package flows for multi-die systems.
- Methodology Development Lead for heterogeneous integration flows development and training for internal design and customers
- EDA development flows – partner with EDA vendors and internal PDK, design teams
- Work with product line management and marketing teams to scope customer requirements and design flows adoption in the market.
- Work with cross-geo, cross-functional teams to understand requirements and communicate resolution in a timely manner.
- Mentor and train junior engineers towards building effective software and automation features
Other Responsibilities
- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Required Qualifications
- Expertise in methodology design and model verification of RF, AMS, silicon photonics & packaging design for wafer-to wafer, die-to-wafer applications
- Expert knowledge of industry standard EDA tools and flows
- Expert knowledge of analog, RF, AMS & digital design EDA tools and flows to drive integration level requirements
- Requires a Bachelor of Engineering (B.E.) or equivalent degree in a related field from an accredited university.
- B.E./B.Tech/Masters/PhD + minimum of 15+ years of relevant industry experience
- >10 years of experience in relevant design or design enablement of IPs.
- Language Fluency – Fluent in English Language – written & verbal.
- Must have proficient knowledge of and experience with Unix environment.
- Must have good technical verbal and written communication skills and ability to work with cross functional teams is necessary.
- Be able to collaborate with programming and technical design leads on multiple concurrent projects.
- Excellent problem-solving skills, written & oral communication, teaming & interpersonal skills.
- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements, and programs.
- Familiarity with standard engineering practices like Version Control systems, Configuration Management and Regression process
Preferred Qualifications.
- Education – Bachelors or Masters or PhD in Electrical Engineering with any
- Experience - Relevant industry experience in Design flows, methodology development.
- Skills - java coding and/or genAI interest/coursework
- Project management skills - i.e., the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
- Strong written and verbal communication skills.
- Strong planning & organizational skills.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at [Confidential Information] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia
