Object-Oriented Programming (OOP), Debugging Tools, Linux System Programming, C++ Programming, Python, Runtime systems, AI accelerator runtime stacks, Memory hierarchy, parallel systems, DMA, debugging skills, performance analysis frameworks, scheduling execution models

Device Drivers, C, Usb, C++, Continuous Integration, Pwm, Embedded Linux, Spi, Pcie, I2c, HSIO devices, eMMC, host client drivers, device tree support, DMA, USB driver experience, Yocto distribution, LSIO devices

memory controllers , C, C++, WDDM, Computer system architecture, MCDM, Microcontroller fundamentals, Caches, Kernel experience on Linux or Windows, Buses, DMA, Operating systems fundamentals, Windows Driver Models

C, Spi, MATLAB, Can, Lin, Flexray, ADC, NVM, MISRA Rules, DIAG, Diagnostics UDS, DMA, CAN LIN Stack, Automotive development, Embedded Systems, Automotive SPICE, RTOS OSEK, COM, Microcontrollers, Driver Development, driving assistance systems, Interrupt, Functional Safety, Autosar, Watchdog, Signal Processing Detection and Estimation, Timer, Bootloaders, Non-AUTOSAR architecture, Memory Stack

potentiostat , Electrochemical impedance spectroscopy (EIS), Chronopotentiometry, Linear sweep, Catalyst ink and coating work, Ionomer characterization, Electrochemistry fundamentals, Data analysis in Python, cyclic voltammetry

Kernel Internals, Migration, Bash Scripting, Pcie, Shell scripting, Linux Kernel, Python, Debugging, Automation, Device Drivers, Yocto, Memory Management, Device Driver Interfaces, Recipe management, CI CD, Intel, Layer customization, Hardware communication, AMD, DMA, Automated regression testing, BitBake, Embedded Linux builds, Interrupt handling, Kernel modules, x86 64 platforms, Low-level hardware integration, x86 Architecture

semiconductor packaging , silicon photonics , fib, Electronics Manufacturing, advanced PCB technologies, solder joint characterization, advanced failure analysis techniques, SMT assembly, laser soldering, failure root-cause investigations, EDS, flip-chip underfill, RF optical modules, X-ray inspection, die attach, cross-section analysis, reflow soldering, thermal profiling, Sem, Industry 4.0 automation

material process tech, Sem, high-NA DUV imaging, semiconductor fabrication, defectivity, electron-matter interaction

Outlook, Excel, Powerpoint, Microsoft Word, polymer chemistry formulations, self-adhesive films, Product Development, new product commercialization process, Lab Testing

C, Gerrit, Soc Architecture, Jenkins, Git, Pcie, Shell scripting, Python, Multi-threaded programming, Hardware Software Bring-up, Test Automation Frameworks, System Validation, Memory hierarchy, power management, Software Quality and Regression Testing, DMA, Open Source AI Models and Framework Integration, Chipset Power Blocks, Deep learning transformer architecture