Micron's Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology.

The Senior Engineer supports Thin Films (CVD/Diffusion) process development for advanced NAND technology by executing experiments, characterizing films, troubleshooting process and tool issues, and supporting process transfer into manufacturing. Success in this role requires strong fundamentals in thin film deposition and characterization, disciplined experimental execution (DOE/SPC), and effective collaboration across integration, metrology, failure analysis, yield, and equipment partners.

Main Responsibilities

Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets.

Design and execute experiments, analyze data, and communicate results in appropriate technical forums.

Perform film characterization using appropriate techniques (examples referenced: SEM, TEM, XPS, SIMS, AFM) and correlate results to process outcomes.

Support process transfer and pilot line execution, including sustaining process maturity/capability for processes under ownership.

Collaborate with multi-functional partners (Process Integration, Metrology, Surface/Characterization labs, Electrical Failure Analysis, Yield, Manufacturing, and equipment vendors/suppliers) to ensure robust processes that meet physical/electrical requirements.

Other Responsibilities

Maintain accurate documentation of experiments, process settings, and learnings produce technical reports and summaries.

Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

AI Responsibilities:

Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

Candidate Profile

Minimum Required Qualifications / Experience

PhD, or Master's ≥3 yrs, or Bachelor's ≥5 yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field

Demonstrated foundation in thin film deposition and characterization R&D/PD environment readiness is important for this role.

Must-Have Technical Skills

Fundamentals of thin film deposition (CVD/Diffusion) and film characterization.

DOE/SPC basics ability to analyze experimental data and draw conclusions.

Understanding of plasma/vacuum systems and process chemistry relationships (where applicable).

Must-Have Soft Skills

Structured problem-solving and learning agility in an R&D environment.

Clear communication and cross-functional collaboration.

Highly Desirable / Preferred

Exposure to dielectric / carbon-based films and NAND structural/electrical requirements.

Experience working with equipment suppliers or tool qualification/transfer activities.

AI Requirements

Ability to apply baseline digital fluency and role appropriate AI literacy to use AI enabled tools responsibly and effectively for research, analysis, content creation, problem solving, operational tasks, and achieving business outcomes.

Embody Micron's core values:

People - Respect, develop and empower others

Innovation - Drive continuous improvement and breakthrough thinking

Tenacity - Show grit and determination

Collaboration - Build trust and foster teamwork

Customer Focus - Deliver excellence and value

SR ENGINEER CVD ADV. NAND PD