programming, Root Cause Analysis, Failure Analysis, semiconductor device physics

C#, Software Development Lifecycle, C++, Sql, Devops, Test automation, Software Architecture, Quality assurance, Agile Development, Release management, Software engineering methodologies, AI-assisted software engineering, Industrial automation software, Distributed control systems, CI/CD

semiconductor packaging , silicon photonics , fib, Electronics Manufacturing, advanced PCB technologies, solder joint characterization, advanced failure analysis techniques, SMT assembly, laser soldering, failure root-cause investigations, EDS, flip-chip underfill, RF optical modules, X-ray inspection, die attach, cross-section analysis, reflow soldering, thermal profiling, Sem, Industry 4.0 automation

stability testing , Morphological characterisation, Characterisation equipment and testing infrastructure, Device fabrication, Failure Analysis, Perovskite single-junction and tandem solar cells

automation transformation initiatives, quality management systems, CI CD integration, verification methodologies, scalable test frameworks, release quality governance, engineering productivity improvements, risk-based testing, automation strategies

.NET, Jsp, Sql, Agile, C, Java, HTML, J2EE, Data Manipulation Language, Waterfall, Xml, Javascript, Data storage subsystems, Complex data models, Development methodologies, Test-driven development, Normalized dimensional data modeling, Resource models