thermal analysis , SAP, Ansys, Bolted Structure Analysis, Non-Linear Analysis, Finite Element Analysis, Classical Hand Calculation Methods, ABAQUS

virtual prototyping , BEOL integration, IC package development, CPI concepts, Thermo-mechanical analysis, Fea, Test vehicle development, Power integrity modeling, Multi-physics simulation, Semiconductor fabrication assembly test processes, Cross-functional project coordination, Front-end fab processes, Thermal simulation

ANSYS, Ugnx, Repair design substantiation, Repair techniques, Teamcenter, New Repair development, Stack-up Analysis