Similar Jobs - 67605264

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Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

micron semiconductor asia operations pte. ltd.

5-8 yrs

SGD 0.96 - 1.68 LPA

Singapore

Skills:

Data Analytics, Visual Basic, Sql, Python, R, Spc, E3 FDC, Doe, RMS Recipe Management System

Early Applicant

Senior Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Micron Technology

3-5 yrs

Singapore

Skills:

Data Analytics, Visual Basic, Dashboarding, Python, Sql, R, Spc, E3 FDC, Doe, defect analysis, RMS Recipe Management System

Early Applicant

Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

WhiteCrow Research

2-4 yrs

Singapore

Skills:

Advanced Packaging, Sql, Visual Basic, Data Analytics, Python, Micro-Bump Fine-Pitch Interconnects, Encapsulation Technologies, Spc, Defect analysis, Die Singulation, Wafer Dicing, E3 FDC Fault Detection and Classification, Hybrid Bonding, RMS Recipe Management System, R, Doe, Underfill

Early Applicant