Fmea, reflow, plasma cleaning, finite element simulation, Jmp, structured 8D problem-solving tools, pick place, underfill curing, Minitab, flux engineering, TCB NCP flux-less flow, SPC controls

Front End Engineering Design (FEED), Distributed Control System (DCS), Safety Case Regime, Iso9001, ISCC plus, MOC, Fmea, Process Improvement, IATF16949, SS651, Logic and sequence modification, Management of Change system, ISO45001, Control plan studies, NRW, Hazop, Industry 4.0 related technologies, Iso14001, Energy Management System

Process Automation, Root Cause Analysis, Fmea, Process Validation, Food Safety Management System, Process Controls, Cgmp, Control Plan, Fixture Fabrication, Fixture Tooling, Corrective Action Report, Process Flow Chart, Improvement, Doe

Membrane Contactor, Mass balances, Degasification, Disinfection, MMF Softeners, Ozone Destructors, Vacuum UV, ultrafiltration, Wastewater Reclaim, TOC reduction, UPW Systems, Advanced Oxidation, Mixed Bed Polishers, HAZOP participation, AWN neutralization, Equipment sizing software, IX Reclaim systems, High-Recovery RO, RO EDI, MBR

Failure Analysis, Fmea, Spc, laser diode assembly, Lean Manufacturing, operations management, 8D, manufacturing process development

Microsoft Office, Kaizen, Productivity Improvement, Cost Reduction, Autocad, Lean Manufacturing, Pfmea, Six Sigma, QCP, process validation per ISO 13485, Yield Improvement

Javascript, Cicd, CDK, Python, Lean Six Sigma

Testing, ocap, Encapsulation, CQM, ISO14001 2004, Fmea, Spc, Maintenance of die attach wire bond encapsulation and testing machinery, ESEC ASM KNS wire bonders, IC assembly processes, Wire bond, ISO9001 2000, Die attach, Copper wire bonding, Doe, JEDEC, QEMS

Fmea, Spc, Doe, process engineering software systems, Mes

Power Bi, Microsoft Excel, programming, 8D methodology, Fmea, data processing tools, Doe, Microsoft Office Applications