Process Control, wet etch behavior, Root Cause Analysis

adhesive epoxy or other bonding material, active alignment process optics bonding equipment, quantitative measurement methodology, optics alignment process, design of experiment, camera module process development, Root Cause Analysis, engineering statistic, metrology tools, camera active alignment process development, image and optical test

Root Cause Analysis, Statistical analysis using JMP software, Laser Marking processes, Asymtek Dispensing Systems, Dfmea, EO Technics Laser Marking Equipment, Pfmea, Dam Fill encapsulation processes, Quality improvement methodologies

Solidworks, Matlab, Python, Spc, Autocad, 8D, Six Sigma, dispensing and pick place process, Jmp, Statistical Process Control methodologies, Minitab, data analysis packages, Doe