. Meds Technologies Pte Ltd is seeking a hands-on PCB Assembly / Manufacturing Engineer to support and optimize Surface Mount Technology (SMT) manufacturing processes for electronic and semiconductor products. The Engineer will be responsible for process development, production yield improvement, equipment optimization, quality enhancement, and technical problem-solving to ensure efficient and reliable manufacturing operations.

. The role requires strong knowledge of SMT assembly, electronics manufacturing processes, manual soldering techniques, IPC standards, and process troubleshooting. Experience in semiconductor manufacturing, failure analysis, process validation, and continuous improvement initiatives is highly desirable.

. The Engineer will be responsible for both daily production execution and manufacturing process optimization, improve productivity and product quality, resolve manufacturing issues, and support NPI activities.

Process Engineering

. Develop, optimize, and maintain SMT manufacturing processes to achieve production, quality, and cost objectives.

. Establish and monitor process parameters for screen printing, pick-and-place, reflow soldering, AOI inspection, and related SMT processes.

. Conduct process capability studies and implement corrective actions to improve yield and reliability.

. Analyze manufacturing data and identify process improvement opportunities.

. Lead root cause analysis and corrective/preventive actions (CAPA) for process-related issues.

Equipment & Technical Support

. Provide technical support for SMT equipment including pick-and-place machines, reflow ovens, printers, AOI, and supporting manufacturing systems.

. Troubleshoot equipment and process issues to minimize downtime and improve productivity.

. Work with maintenance teams to establish preventive and predictive maintenance programs.

. Support equipment qualification, validation, calibration, and commissioning activities.

Quality & Reliability

. Ensure products meet IPC standards, customer requirements, and internal quality standards.

. Review and analyze defect trends, yield losses, and process variations.

. Lead investigations involving soldering defects, component placement issues, and assembly-related failures.

. Implement process controls and quality improvement initiatives to enhance reliability.

New Product Introduction (NPI)

. Support NPI activities including process development, pilot builds, and production ramp-up.

. Review product designs and manufacturing requirements to ensure manufacturability.

. Develop and maintain work instructions, process documentation, and manufacturing standards.

. Participate in Design for Manufacturing (DFM) and Design for Assembly (DFA) reviews.

Continuous Improvement

. Drive productivity, automation, quality, and cost-reduction projects.

. Apply Lean Manufacturing, Six Sigma, and continuous improvement methodologies.

. Monitor KPIs related to yield, cycle time, scrap, downtime, and overall equipment effectiveness (OEE).

. Recommend and implement process enhancements to improve operational efficiency.

Technical Leadership

. Provide technical guidance and training to technicians and operators.

. Collaborate with cross-functional teams to resolve manufacturing challenges.

. Support audits, customer inspections, and regulatory compliance activities.

. Prepare technical reports and present findings to management

Job Requirements

. Bachelor's Degree in Electronics Engineering, Electrical Engineering, Manufacturing Engineering, Mechanical Engineering, or related discipline.

. Diploma holders with extensive SMT engineering experience may also be considered.

. Minimum 3 to 5 years of experience in SMT, electronics manufacturing, semiconductor assembly, or related manufacturing environments.

. Strong knowledge of SMT processes including screen printing, component placement, reflow soldering, AOI, and rework processes.

. Experience in process optimization, yield improvement, and root cause analysis.

. Familiarity with IPC standards, preferably IPC-A-610 and IPC J-STD-001.

. Experience with process validation, equipment qualification, and manufacturing quality tools.

. Knowledge of Lean Manufacturing, Six Sigma, SPC, PFMEA, Control Plans, and CAPA methodologies.

. Hands-on experience in precision soldering, rework, and failure analysis is preferred.

. Proficiency in data analysis and reporting tools such as Excel, Minitab, Power BI, or equivalent.

. Preferred IPC-A-610 Certified IPC Specialist (CIS), IPC J-STD-001 Certification, Lean Six Sigma Green Belt or equivalent

PCBA/Manufacturing Engineer