Product Testing, Active optical alignment, Ongoing reliability testing, Wire bond, 1.6T products, Report Generation, Burn-in, Quality control best practices, Process implementation for optical products, Root cause corrective action, Debug failure analysis, Optical transceiver manufacturing, Die bond, Optics FA processes and tools, Yield analysis, Quality Management System, Optical assembly processes, Root cause problem solving, Manufacturing BOMs, Data Analysis, Quality standard requirements

Zigbee, Matter, RF-enabled devices, Wi-Fi, IC manufacturing test processes, Failure Analysis, Statistical problem-solving methods, Analog mixed-signal ICs, Data analysis tools

Python, scripting tools, device physics, Jmp, DRAM architecture, Statistics, Data Analysis, CMOS technology