Renesas is a global semiconductor leader shaping the backbone of next-generation automotive, industrial, cloud, and IoT innovation. With over $9.3 billion in annual revenue (2024) and a world-class team of 22,700+ employees, Renesas operates at scale while retaining the agility to drive category-defining breakthroughs. The company's footprint spans more than 30 countries, enabling deep customer proximity and a uniquely global innovative engine. As Japan's semiconductor powerhouse and a top global player in microcontrollers, analog, and power technologies, Renesas delivers real-world impact across EVs, smart factories, renewable energy infrastructure, and edge intelligence. For ambitious problem-solvers who want to work on meaningful, systems-level challenges with huge industry leverage, Renesas offers the scale, stability, and strategic clarity of a market leader, paired with the transformative momentum of a company reinventing how the world computes, connects, and electrifies.

Renesas has a growing presence in India with HC approaching 1000+ and significant presence with active government and university collaboration as well as OSAT footprint (JV with CG India). With the growing importance of India as a market (growing semiconductor market and government goals / mandates of localization needs) and talent hub, our division's (India for India) mission is to grow India market. We aspire to create products (SoCs, software, power and analog chips etc.) which serve needs for local market. Renesas is a leading electronics supplier globally, and this is a unique opportunity to directly influence the future products which will be offered to our customers in a new, fast growing and large Indian market with specific needs and applications.

Job Description

We are seeking a Director, Engineering with deep expertise in mixed-signal IC development to support Renesas India-focused growth initiatives. This role is technical, cross-functional, and product-defining.

The successful candidate will define optimum system architecture for application-specific ICs, spanning analog signal-chain products, high-power delivery, mixed-signal integration, and digital-controller-based architectures. The role will map product needs to existing Renesas IP across business units and identify where new development is required.

You will be expected to collaborate across business units, system engineering, analog packaging, back-end, design, test, and operations teams to execute IC development with an efficient cost structure. You will also identify critical skill-set requirements and build the right technical team from scratch.

Product & Architecture Leadership

Work with product definition / IC architect team to optimize system architecture for application-specific ICs serving India market requirements across automotive, industrial, power, and mixed-signal applications.

Understand customer use cases, system requirements, cost targets, and application constraints to optimize architecture

Cover a broad technical span, ranging from analog signal-chain products to high-power delivery with digital controllers.

Drive architecture trade-offs across performance, integration level, BOM cost, manufacturability, qualification effort, and reuse of existing Renesas technology.

Cross-Business Unit IP Reuse & Collaboration

Map target architectures to available IP across different business units within Renesas and identify gaps requiring new development.

Collaborate with multiple business units, system engineering, analog packaging, back-end, design, test, and operations teams to execute the development plan.

Repurpose existing resources and IP wherever practical, while being clear where reuse creates unacceptable product, schedule, or execution risk.

Create structured technical alignment across stakeholders who may have different priorities, schedules, and ownership models.

Development Execution

Lead development programs through concept definition, architecture, specification, planning, execution, verification, validation, qualification, and production handoff.

Build execution plans that include ownership, milestones, technical risks, resource needs, cost assumptions, and decision gates.

Ensure development choices are grounded in realistic foundry, packaging, test, DFT, qualification, and manufacturing constraints.

Collaborate with system engineering teams to define IC requirements and ensure the product solves real application-level problems.

Automotive Quality, DFT & Reliability Planning

Understand automotive qualification requirements for integrated circuits during design planning and translate them into execution needs.

Plan required DFT structures, test coverage, reliability flows, and production test implications early in the design phase.

Understand system-level fault behavior, protection needs, and safety-related requirements where relevant to automotive and industrial applications.

Create a practical bridge between product ambition and qualification realities, including schedule, cost, and silicon iteration risk.

Team Building & Technical Leadership

Identify critical skill-set requirements and hire the right people for the development team.

Build and mentor a high-quality technical team, including architecture, design, verification, validation, and execution contributors.

Assess technical depth during hiring and avoid over-reliance on surface-level experience claims.

Represent the program in senior leadership reviews with clear choices, trade-offs, risks, and asks.

Qualifications

15+ years of experience in mixed-signal IC, analog IC, power IC, or related semiconductor product development.

Bachelor or Masters of Electronics Engineering related discipline from a reputed institution.
Experience in leading IC development with multiple functional teams is a must for this role.
Good understanding of history and future trends in semiconductor industry.
Awareness of foundry capabilities for different CMOS, BCD and FET technologies will be an added advantage.
Understanding of automotive qualification requirements for integrated circuits in the design phase and ability to plan execution with required DFT circuits.
Good understanding of advanced semiconductor packaging technologies and their impact on cost, thermal performance, integration, and manufacturability.
Previous experience in building a team from scratch.
Comfort and ability to collaborate and be effective in an entrepreneurial (fast-paced and ambiguous) environment.
Excellent interpersonal, communication and presentation skills and comfort in presenting to a wide range of audiences. Capable to communicate issues in a concise and effective way.
Desire and drive to interact with, as well as ability to build and maintain excellent relationships with internal and external stakeholders.
Product ownership mentality with strong affinity to technical depth.
Self-driven, strongly motivated individual capable to take full ownership of their activities, and to involve other functions in the company or management when needed to bring them to a successful outcome.
Should be motivated to handle unknowns of a beginner.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Director Engineering, Analog Design (Power ICs) - Chip Lead