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Skills:
process qualification , Statistical Analysis, Root Cause Analysis, Overlay accuracy, Process Recipes, Control Plans, Exposure dose and focus, Lift-off lithography processes, photolithography, FMEA methodologies, Photoresist coating, Pattern fidelity and defectivity, Broadband i-line DUV 193 nm aligner stepper scanner platforms, Etch processes
Skills:
thermal oxidation , diffusion, thin film deposition, Fmea, wafer thinning, process control plans, OCAP execution, SPC strategies, metal passivation, implantation, statistical data analysis tools, DOE methodologies
Skills:
Matlab, SOP technical documentation, Data Analysis, Process Optimization, Doe, Semiconductor front end, Hybrid bonding, Jmp, MS-Office
