Welcome to Micron's Advanced NAND Process Pathfinding Team - where the next generation of memory technology is developed. We operate at the groundbreaking forefront of semiconductor innovation, engineering world-class memory solutions built for uncompromising performance. If you're ready to redefine what's possible in NAND process technology, we'd love you on this journey with us.

As a Principal Engineer / Member of Technical Staff (MTS) - Thin Films, you'll spearhead groundbreaking initiatives alongside some of the industry's most accomplished technologists. Your mission: architect and deploy next-generation thin film fabrication methods that keep Micron ahead of the global competition. This is a role for a technical leader who thrives on solving the toughest challenges in materials, deposition, and device integration.

Responsibilities:

Advance thin film process development to meet demanding structural, electrical, and reliability targets across the NAND roadmap.
Lead the creation of thin films for next-generation NAND cells, including dielectric, conductive, interface, and charge-storage layers.
Explore new materials, precursor chemistries, and deposition techniques to unlock future scaling and architectural breakthroughs.
Partner across fields - collaborating closely with Device Engineering, Process Integration, and Yield teams to improve cell performance, reliability, and manufacturability.
Lead technical task forces and mentor engineers, resolving complex structural and integration issues while establishing best-practice guidelines for the broader team.
Leverage AI-enabled engineering tools, advanced analytics, and digital workflows to accelerate process development, improve decision-making, enhance knowledge management, and increase R&D productivity across thin film technology initiatives.

Minimum Qualifications:

Hands-on expertise across CVD, LPCVD, PECVD, ALD, PEALD, and MOCVD processes.
Deep understanding of thin film reactors, material properties, and how they influence device performance and reliability.
Strong foundation in plasma physics, transport phenomena, or surface chemistry.
Demonstrated success in developing new thin film materials and deposition methods from concept to integration.
Proven leadership in driving technical programs and engaging effectively with equipment and materials vendors.

Preferred Qualifications:

PhD/MS with 7-10+ years of relevant experience in thin films / semiconductor process development.
Proficiency in statistical process control (SPC) and advanced data analysis techniques.
Sharp problem-solving instincts with the ability to get results independently.
Excellent communication and presentation skills - able to influence at every level.
Experience mentoring engineers and leading high-performing technical teams.
Experience applying AI, generative AI, or advanced data science techniques to semiconductor process development, materials research, process optimization, or engineering automation.

Join a team where curiosity is currency, collaboration is culture, and your work directly builds the memory that powers AI, mobile, automotive, and data center innovation worldwide. If pushing the boundaries of NAND excites you, this is where you belong!

Principal Engineer / MTS NAND Process Pathfinding - Thin Films