10g, Usb, Ethernet, Pcie, multi-sensor integration, DDR4, high-speed digital boards, ISO 26262, FMEDA, DDR5, Fmea, MIPI CSI, camera radar LiDAR fusion, LPDDR interfaces, high-speed interfaces, impedance stack, Thermal Design, SGMII, dsi, RMII, BOM optimization, RGMII, ASIL-D compliance, SERDES

Usb, virtualization, Networking, Pcie, Boot, interconnect system memory QoS, Debug, DDR memories, ARM architecture specifications, machine-learning compute, SoCs, multimedia pixel processing, power operating state management, coherent and non-coherent interconnect