surface preparation , Data Analysis, Fmea, wafer to wafer hybrid bonding, Spc, semiconductor bonding processes, advanced packaging technologies, CMP interaction, 8D, fusion bonding, Cu plating, defect mechanisms, HBM, Statistical Modeling, TSV, Doe

Statistical Analysis, advanced process control methodologies, immersion lithography, OPC development, photolithography processes, material characterization, Optics, polarized illumination, lithography simulation tools, reticle layout, low k1 imaging, Doe, process window analysis, overlay optimization, Simulation Software

LabVIEW, C, MATLAB, Python, Solidworks, Jmp, LayoutEditor, KLayout, Optical engine products, Lumerical FDTD, R, zemax, RSoft, Data collection and analysis using Excel

cmp , Fmea, process integration, Spc, Sops, FDC, 8D, Rca, surface inspection, NPI technology transfer, APC, film thickness measurement, yield improvement