Job Title: Training Technicians

Key Responsibilities

Deliver practical and theoretical training on IC manufacturing processes such as:
Wafer handling and preparation
Die attach, wire bonding, and flip-chip processes
Encapsulation / molding techniques
Trimming, forming, and singulation
Electrical testing, burn-in, and final test
Train students on semiconductor equipment operation, tool handling, and basic machine troubleshooting.
Instruct trainees on cleanroom protocols, ESD control, contamination control, and safety practices.
Demonstrate process flow from wafer to finished IC package and explain yield, defects, and failure modes.
Conduct hands-on labs, simulations, and process demonstrations as per OSAT curriculum.
Prepare trainees for OSAT / NSQF-aligned skill assessments through mock tests and skill evaluations.
Ensure compliance with quality systems such as SPC, SOPs, and basic ISO practices relevant to IC manufacturing.
Maintain training equipment, ESD stations, and consumables; ensure calibration and readiness.
Track trainee performance, attendance, and competency development; maintain training documentation.
Support internal and external assessors during OSAT certification assessments.
Provide basic orientation on semiconductor industry expectations, shift culture, and shop-floor discipline.
Coordinate with industry partners, assessment bodies, and placement teams when required.

Required Qualifications

ITI / Diploma in Electronics, Electrical, Mechatronics, Instrumentation, or Semiconductor Technology.
OSAT / NSQF / Semiconductor Skill Certification preferred.

Experience

1–5 years of hands-on experience in IC manufacturing, semiconductor assembly & test, or electronics manufacturing.
Experience in cleanroom or ESD-controlled environments is highly desirable.
Training or mentoring experience is an added advantage.

Technical Skills

Soft Skills

Work Environment

Key Performance Indicators (KPIs)