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Skills:
ANSYS based FEA, Vibration Analysis Tools, Solid Edge, ICEPACK, electronics packaging, Teamcenter, CAD engineering tools, Mechanical design analysis, Nx, SHERLOCK, Thermal CFD Analysis Tools, Power electronics product development
Skills:
ICEPACK, Vibration Analysis Tools, ANSYS based FEA, Solid Edge, electronics packaging, Teamcenter, Mechanical design analysis, CAD engineering tools, SHERLOCK, Nx, Thermal CFD Analysis Tools, Power electronics product development
