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Showing 4 jobs
Skills:
Data Analysis, cross-functional leadership, ATE test programs, AI-assisted tools, wafer cube probe test solutions, NPI execution, Root Cause Analysis, DFT process test
Skills:
Statistical Analysis, Advanced Analytics, process integration
Skills:
3d packaging , Si Photonics based packaging design, wafer level packaging process flow, CST, statistical analysis tools, PowerSI, hybrid multi-chip integration, Momentum, SI-Wave, IE3D, hfss
Skills:
Preventive Maintenance, Capacity Planning, Root Cause Analysis, Ms Power Point, Energy Performance, Energy Efficiency Projects, Electrical Engineering, Maintenance, power quality, Risk Management
